Ring PCB's High Frequency PCB, High Temperature(High TG) PCB, High Density PCB, HDI PCB, Teflon PCB, Gold Plating PCB and other Advanced Circuit have been widely used in communications products.
Communication
Ultra-thin, small, multi-function is the development trend of communications products, leading to the Printed Circuit Board have become increasingly demanding. Ring PCB has many years experience in production of Printed Circuit Boards of communication products, that can quickly meet your communications products circuit board special Materials and Special Process requirements. Such as High Frequency PCB, High Temperature PCB(High TG PCB),High Density PCB ( HDI PCB ), Teflon PCB, Gold Plating PCB and other Advanced Circuit.
Find out about our more info, Please contact us at info@chinapcbone.com .
PTFE high frequency material
immersion gold, 4mil IC
14L High TG FR4
imepedance, 0.4mm plug-in hole
LF-HASL FR4 4OZ for all layer, via in pad
16L, OSP ,Rogers+FR4 laminating
blind& buried hole, via in pad, high frequency
LF-HASL, FR4
3OZ for all layers
LF-HASL, FR4
step board, blind hole
Immersion gold, Rogers
high frequency material
14L high TG FR4
4/4mil differential impedance 0.5CSP