Full Turnkey PCBA Pre-Shipment Quality Control Process
We provide one-stop full turnkey PCB assembly service, and implement a multi-dimensional closed-loop quality control system for all circuit board assemblies. No PCBA will be packaged and shipped out of our factory until it completes all standardized inspection procedures. We fully adopt Automated Optical Inspection (AOI) and X-ray non-destructive testing as core detection processes, supplemented by functional testing and manual rechecks to eliminate hidden defects completely.
Introduction to Core Testing Equipment
1. Automated Optical Inspection (AOI Inspection)
AOI is an intelligent visual inspection machine deployed immediately after SMT component soldering. It captures high-definition surface pictures of PCBA through industrial cameras, and matches the pictures against your original PCB design files via built-in AI algorithms.
It can rapidly identify all surface welding and assembly defects: missing electronic components, tilted chips, tombstoning, solder bridging, insufficient solder, excess solder and surface scratches. Defective boards will be automatically marked and delivered to the rework station to fix surface flaws at the earliest production stage.
2. X-Ray Inspection
Different from AOI which only checks the board surface, X-ray inspection is designed for hidden solder joints that cannot be seen by naked eyes or cameras, mainly for BGA, QFN, micro chips and bottom-mounted components.
The X-ray equipment penetrates the circuit board to form clear images of internal solder balls, detecting invisible risks such as solder voids inside BGA pads, cold solder joints, internal short circuits and incomplete bonding. This non-destructive test ensures the long-term connection stability of tiny packaged chips and avoids post-delivery product breakdowns caused by internal welding faults.
Complete QC Procedures All PCBA Must Pass Before Packaging & Shipment
Every finished PCBA will go through the full set of inspection steps in sequence:
Post-SMT AOI Scan: Full surface detection of all SMT components and solder joints
X-Ray Non-Destructive Scanning: Check hidden internal solder points of BGA/QFN chips
Secondary Manual Visual Recheck: Artificial screening for minor defects missed by automated machines
Functional Circuit Test (FCT): Simulate your product’s real operating environment, test power supply, signal transmission, circuit conduction and all customized functional indicators; only boards passing all electrical standards can proceed
Burn-in Aging Test (Customizable): Long-time continuous power-on operation to filter out unstable components with early failure risks
Final Appearance & Mark Inspection: Check silkscreen, product labels, board cleanliness and physical damage
Packing Audit: Verify anti-static packaging, order quantity, shipping marks and package tightness
With 18 years of full turnkey PCBA manufacturing experience, we finish PCB fabrication, component procurement, SMT assembly and all quality tests in our own factory. All test records are archived to achieve full batch traceability, meeting strict quality standards for industrial control, medical devices, automotive electronics and IoT hardware. We accept small prototype batches and large-scale mass orders with stable consistent quality.
Send your Gerber files, BOM list and customized testing requirements to get your free PCBA quotation today.
Email: rfq@ringpcb.com
Official Website: https://www.ringpcb.com
