Controlled depth milling is a vital process in PCB (Printed Circuit Board) manufacturing. It involves the precise removal of material from the PCB's surface, typically to achieve the correct thickness, depth, or pattern. This process ensures that the PCB has the necessary properties, such as signal integrity and performance, while adhering to the required specifications.
During controlled depth milling, a milling tool is used to remove specific layers of the PCB material with high precision. The process is controlled to ensure that the desired depth is achieved without affecting other layers or components of the PCB. It is essential in situations where precise material removal is required, such as in fine-pitch designs and complex multilayer PCBs.
Controlled depth milling is especially useful in applications that require high precision, such as in telecommunications, automotive, and aerospace industries. These industries rely on the performance and reliability of the PCBs, where even a small error can lead to significant issues.
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