Copper plating in IPC Class 2 standards ensures reliable electrical connections and long-term durability for consumer electronics and industrial products.
Understanding Copper Plating in IPC Class 2 Standard: Key Considerations
Copper plating is a critical process in the manufacture of Printed Circuit Boards (PCBs), particularly in IPC Class 2 standards. These standards ensure that the copper plating process meets industry requirements for reliability and quality. For IPC Class 2 boards, the copper thickness in drilled holes is especially crucial for ensuring conductivity and structural integrity.
At the core of the IPC Class 2 standard, copper plating must provide strong electrical connections and resistance to heat and mechanical stress. Our manufacturing process allows for copper plating as thin as 20 microns (µm), ensuring that the copper layer inside the drilled holes is both conductive and durable for devices that will undergo repeated use.
The precise copper plating helps prevent the risk of signal loss and ensures the PCB’s reliability in everyday applications. Furthermore, this level of plating also supports high-frequency performance, which is essential for modern electronics such as smartphones and automotive systems.
