How 20um Minimum Copper in Hole Wall Enhances IPC Class 2 Performance

The copper plating in PCB holes plays a pivotal role in meeting the mechanical and electrical requirements of IPC Class 2 standards. A critical aspect of this is ensuring the copper thickness in the holes meets a minimum of 20um, which is essential for achieving both strength and conductivity.

RingPCB Technology Co., Ltd is renowned for providing 20um min copper in hole wall, a key factor in enhancing the overall performance of PCBs. This standard ensures reliable electrical connections and excellent mechanical durability, which are essential for meeting the performance expectations of IPC Class 2 products.

By maintaining a consistent copper thickness of at least 20um, RingPCB Technology ensures that their PCBs provide reliable conductivity, which is especially important in applications where performance under normal operating conditions is critical. This level of copper plating ensures a solid and durable connection between components, contributing to the overall stability of the PCB.

In conclusion, ensuring the correct copper thickness in hole walls is a vital component of meeting IPC Class 2 standards. RingPCB Technology’s focus on providing 20um min copper in hole wall ensures their products deliver exceptional performance and reliability in a wide range of electronic applications.

Conclusion

The use of 20um min copper in hole wall is crucial for meeting the requirements of IPC Class 2 standards, and RingPCB Technology’s expertise in this area guarantees high-quality, reliable PCBs for a variety of applications.