ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a crucial PCB surface finish offering superior reliability, wire bondability, and shelf life. This finish is widely used in aerospace, medical, and high-frequency PCBs.
ENEPIG consists of three layers:
Electroless Nickel (Ni): Acts as a strong barrier layer.
Electroless Palladium (Pd): Prevents nickel corrosion and oxidation.
Immersion Gold (Au): Enhances solderability and protects against environmental damage.
ENEPIG is beneficial due to:
Wire bondability for both gold and aluminum.
Strong corrosion resistance and oxidation prevention.
Extended shelf life and lead-free solder compatibility.
ENEPIG is widely applied in:
Automotive electronics.
High-speed and RF PCBs.
Aerospace and medical devices.
With its numerous advantages, ENEPIG has become the preferred choice for high-reliability applications.
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