The Benefits of ENEPIG in Solderability and Wire Bonding

ENEPIG is widely recognized for its ability to create defect-free solder joints and strong wire bonds.

How ENEPIG Enhances Solderability

• Nickel provides a stable soldering foundation.
• Palladium prevents intermetallic corrosion.
• Gold enhances wettability and ensures defect-free joints.

Wire Bonding Advantages of ENEPIG

Unlike ENIG, which suffers from black pad issues, ENEPIG supports both gold and aluminum wire bonding.

ENEPIG vs. Other PCB Finishes

Compared to HASL, ENIG, and OSP, ENEPIG offers superior soldering consistency, stronger bonding, and better oxidation resistance.

For high-end PCBs, ENEPIG ensures optimal soldering and bonding performance.