When selecting a PCB surface finish, the choice between HASL and Immersion Tin depends on factors like solderability, cost, compliance, and component compatibility. Understanding the differences between these two finishes is essential to making an informed decision.
HASL is a widely used surface finish where the PCB is dipped into molten solder, usually composed of tin (Sn) and lead (Pb) or a lead-free alternative. After immersion, hot air knives remove excess solder, leaving behind a protective coating.
HASL is known for:
However, HASL is not ideal for fine-pitch components due to its uneven surface. It can also create challenges for high-density interconnect (HDI) designs.
Immersion Tin is a lead-free finish where a thin, uniform layer of tin is chemically deposited over the copper traces. Unlike HASL, this finish creates a smooth, even surface, making it suitable for fine-pitch components.
Advantages of Immersion Tin:
However, Immersion Tin has some drawbacks:
Feature | HASL | Immersion Tin |
---|---|---|
Surface Flatness | Uneven | Very Flat |
Solderability | Excellent | Good (Requires Careful Handling) |
RoHS Compliance | Only Lead-Free HASL | Yes |
Shelf Life | Long | Shorter (Prone to Oxidation) |
Fine-Pitch Suitability | Not Ideal | Best for HDI & SMT |
Cost | Lower | Slightly Higher |
HASL is a great choice for cost-sensitive, general-purpose PCBs, offering strong solderability and durability. However, for high-density interconnects and fine-pitch components, Immersion Tin is the superior choice due to its smooth surface and RoHS compliance.
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