Understanding Hard Gold and Immersion Gold – Key Differences

Gold plating is widely used in electronics and manufacturing industries to enhance durability, conductivity, and corrosion resistance. Two common gold plating techniques are hard gold plating and immersion gold plating. While both involve applying a layer of gold onto a metal surface, their processes, characteristics, and applications vary significantly. Understanding these differences is essential for choosing the right plating method.

What is Hard Gold Plating?

Hard gold plating, also known as electroplated gold, is a process where gold is deposited onto a metal surface using an electric current. This method typically combines gold with other elements, such as nickel or cobalt, to improve hardness and wear resistance. Hard gold plating is widely used in high-wear applications, such as edge connectors, switches, and electronic contacts.

What is Immersion Gold Plating?

Immersion gold plating, also referred to as ENIG (Electroless Nickel Immersion Gold), is a two-layer plating process. A thin layer of gold is chemically deposited over a nickel base without the use of electricity. This method provides a smooth, uniform coating and is commonly used in printed circuit boards (PCBs) and microelectronics due to its excellent solderability.

Major Differences Between Hard Gold and Immersion Gold

Hard gold plating is ideal for applications that require durability and repeated physical contact, while immersion gold is better suited for fine-pitch electronic components that require solderability.