IPC Hard Gold Plating Thickness Standards

Introduction

Gold thickness plays a crucial role in determining the durability, performance, and application of plated components. IPC standards such as IPC-4552 and IPC-6012 define minimum and recommended thickness levels for different applications, ensuring that manufacturers produce reliable, long-lasting products.

Gold Thickness Requirements (According to IPC Standards)

• Edge Connectors & Contacts:
  • Minimum: 1.27 microns (50 microinches)
  • Recommended: 2.54 - 5.08 microns (100 - 200 microinches)
• Plated Through-Holes:
  • Not recommended for solderable applications due to low adhesion strength
• Nickel Barrier Layer Thickness:
  • 3 - 6 microns (120 - 240 microinches) to prevent diffusion of gold into copper

Impact of Gold Thickness on Performance

• Thin Coatings (<50µin): Lower durability, prone to rapid wear
• Standard Thickness (50-100µin): Ideal for general PCB connectors and moderate-wear applications
• Thick Coatings (>100µin): Required for high-wear environments, such as industrial and aerospace applications

Choosing the Right Thickness

Manufacturers must consider mechanical stress, electrical requirements, and environmental exposure when selecting the appropriate gold plating thickness to comply with IPC guidelines. Following these standards ensures product reliability, reducing the risk of failure in high-performance applications.