IPC Standards: Hard Gold vs. ENIG Plating
Hard gold plating and ENIG serve different purposes in PCB manufacturing. This article compares IPC specifications for both plating methods.
Comparing IPC Hard Gold Plating to ENIG (Electroless Nickel Immersion Gold)
Introduction
Hard gold plating and ENIG (Electroless Nickel Immersion Gold) are two common gold plating methods in PCB manufacturing. Each method follows specific IPC standards and serves distinct purposes.
Key Differences
| Feature | Hard Gold Plating | ENIG |
|---|
| Gold Thickness | 50-200µin | 2-5µin |
| Durability | High | Lower |
| Wear Resistance | High (for connectors) | Low (prone to wear) |
| Solderability | Poor | Excellent |
| Cost | Expensive | More affordable |
When to Use Each Method
- Hard Gold: Ideal for edge connectors and mechanical contacts
- ENIG: Best for solderable surfaces in PCBs
IPC Standards for Both Methods
- Hard Gold: IPC-6012 & IPC-4552
- ENIG: IPC-4552A
Conclusion
Hard gold plating is better for wear resistance, while ENIG is preferred for solderability and cost savings. Understanding these differences helps manufacturers select the best plating method for their specific PCB design and performance needs.
