Cost and Manufacturing Differences Between Via Tenting and Via Plugging

Introduction

The decision between via tenting and via plugging is often influenced by cost and manufacturing complexity. While both methods improve PCB reliability, their fabrication processes, material requirements, and overall expenses differ significantly.

Cost of Via Tenting

• Lower cost due to minimal material usage
• Only requires standard solder mask application
• Faster manufacturing process

Cost of Via Plugging

• Higher cost due to added materials (epoxy/resin)
• Additional processing steps
• Longer manufacturing time

Manufacturing Differences

Which One is More Cost-Effective?

For standard applications, via tenting is more budget-friendly. However, for high-density and high-reliability applications, the benefits of via plugging outweigh the additional costs. Choosing the right method depends on the PCB’s function, performance needs, and budget constraints.