Design and Manufacturing of Gold Fingers in PCBs

Introduction

Designing gold fingers requires precision and compliance with industry standards to ensure reliable electrical connections.

1. Design Considerations

Gold fingers must:

• Be evenly spaced and aligned to fit into connectors properly.
• Follow specific width and length guidelines depending on application.
• Avoid being plated with solder mask or other coatings.

2. Manufacturing Process

The gold finger manufacturing process involves:

1. Surface Preparation – Cleaning the PCB edge for plating.
2. Nickel Layer Application – A base layer of nickel (usually 100-200 microinches).
3. Gold Plating – A final hard gold layer is electroplated for conductivity.
4. Beveling – The edges are angled to ease insertion into connectors.

3. Industry Standards

Gold fingers must meet IPC-4556 standards, which define plating thickness and quality requirements.

Conclusion

A well-designed and properly plated gold finger ensures smooth connectivity, durability, and optimal electrical performance in PCBs.